1210 (3528 metric)

Q:What defines the physical structure of 1210 (3528 metric)?

A:Key features include:
- Leadless bottom-mounted pads: Ensures stable PCB attachment.
- Central thermal pad (80% coverage): Enhances heat dissipation.
- 2-pin layout with side-by-side arrangement: Simplifies circuit routing.
- 1.2 mm ultra-thin profile: Saves vertical space in compact designs.

Q:Why choose 1210 (3528 metric) over alternatives?

A:Critical advantages:
- Miniaturization: 30% smaller than 2512 packages for high-density PCBs.
- Thermal Performance: Direct PCB heat path reduces junction temperature by ~15%.
- Electrical Benefits: Low-inductance design (<1 nH) for high-frequency stability.
- Reliability: Moisture-resistant ceramic substrate (per IPC-7351B).

Q:What are common technical specs?

A:Standard configurations (consult datasheets):
- Body Size: 3.2 mm × 2.5 mm (3528 in metric).
- Height: 1.2 mm.
- Pin Pitch: 2.0 mm.
- Material: Copper-alloy terminals with Ni/Pd plating.
- Temp Range: -40°C to +125°C (industrial grade).

Q:Where is 1210 (3528 metric) typically applied?

A:Dominant use cases:
- Power converters: E.g., DC-DC modules (e.g., LM2675).
- RF modules: E.g., RF filters (e.g., SAW-1210).
- Sensor interfaces: E.g., current sensors (e.g., ACS712).

Q:What are critical assembly guidelines?

A:Key recommendations:
- PCB Design: Thermal vias (≥4) under the central pad for heat transfer.
- Solder Paste: Type 4 solder (particle size 20–38 µm) recommended.
- Reflow Profile: Peak temp ≤ 245°C (Pb-free process).
- Inspection: X-ray (AXI) mandatory to verify pad soldering.