ВСЕ КАТЕГОРИИ6.35 mm x 5.08 mm
- Картинка & Модели
- Описание
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- Количество
- Операция
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RF Couplers Quadrature Coupling 3dB 1.2GHz to 1.6GHz 4-Pin SMD T/R
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1 + 10 + 25 + 50 + >=100 -
MOQ : 1 Наличность : 2044
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RF Couplers Dual-directional Coupling 30dB 2.3GHz to 2.9GHz 4-Pin CSMD T/R
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1 + 10 + 25 + 50 + >=100 -
MOQ : 1 Наличность : 1415
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RF Couplers Bi-directional Coupling 5dB 2.3GHz to 2.7GHz 4-Pin CSMD T/R
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1 + 10 + 25 + 50 + >=100 -
MOQ : 1 Наличность : 744
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RF Couplers Bi-directional Coupling 5dB 2GHz to 2.3GHz 4-Pin CSMD T/R
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1 + 10 + 25 + 50 + >=100 -
MOQ : 1 Наличность : 9141
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RF Couplers Quadrature Coupling 3dB 1.8GHz to 2.3GHz 4-Pin SMD T/R
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1 + 10 + 25 + 50 + >=100 -
MOQ : 1 Наличность : 4250
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RF Couplers Dual-directional Coupling 30.4dB 1.4GHz to 2.7GHz 4-Pin T/R
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1 + 10 + 25 + 50 + >=100 -
MOQ : 1 Наличность : 3400
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Signal Conditioning 1700-2000MHz IL:.22dB VSWR:1.15
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1 + 10 + 25 + 50 + >=100 -
MOQ : 1 Наличность : 6000
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RF Couplers Dual-directional Coupling 5dB 1.7GHz to 2GHz 4-Pin CSMD T/R
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1 + 10 + 25 + 50 + >=100 -
MOQ : 1 Наличность : 1816
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RF Couplers Quadrature Coupling 3dB 1.7GHz to 2GHz 4-Pin CSMD T/R
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1 + 10 + 25 + 50 + >=100 -
MOQ : 1 Наличность : 3859
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RF Couplers Dual-directional Coupling 30.4dB 0.8GHz to 1GHz 4-Pin CSMD T/R
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1 + 10 + 25 + 50 + >=100 -
MOQ : 1 Наличность : 5268
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RF Couplers Quadrature Coupling 3dB 0.8GHz to 1GHz 4-Pin CSMD T/R
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1 + 10 + 25 + 50 + >=100 -
MOQ : 1 Наличность : 1814
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RF Couplers Quadrature Coupling 3dB 0.8GHz to 1GHz 4-Pin SMD T/R
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1 + 10 + 25 + 50 + >=100 -
MOQ : 1 Наличность : 1678
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RF Couplers Quadrature Coupling 3dB 0.6GHz to 0.9GHz 4-Pin CSMD T/R
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1 + 10 + 25 + 50 + >=100 -
MOQ : 1 Наличность : 1786
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RF Couplers Bi-directional Coupling 20dB 2GHz to 2.3GHz 4-Pin SMD T/R
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1 + 10 + 25 + 50 + >=100 -
MOQ : 1 Наличность : 7500
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Signal Conditioning 2.0-2.3GHz IL:.30dB VSWR:1.20 -55 to 85C
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1 + 10 + 25 + 50 + >=100 -
MOQ : 1 Наличность : 1500
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RF Couplers Uni-directional Coupling 20dB 2.3GHz to 2.7GHz 4-Pin T/R
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1 + 10 + 25 + 50 + >=100 -
MOQ : 1 Наличность : 1540
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Signal Conditioning 2.3-2.7GHz IL:.30dB VSWR:1.20 -55 to 85C
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1 + 10 + 25 + 50 + >=100 -
MOQ : 1 Наличность : 1900
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RF Couplers Uni-directional Coupling 20dB 1.7GHz to 2GHz 4-Pin SMD T/R
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1 + 10 + 25 + 50 + >=100 -
MOQ : 1 Наличность : 9901
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Signal Conditioning 1.7-2.0GHz IL:.25dB VSWR:1.28 -55 to 85C
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1 + 10 + 25 + 50 + >=100 -
MOQ : 1 Наличность : 9608
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Q:What defines the physical structure of DFN-24?
A:Key features include:
- Leadless bottom-mounted pads: Ensures robust PCB attachment.
- Central thermal pad (4.2 mm² coverage): Enhances heat dissipation.
- 24-pin layout with dual-row perimeter arrangement: Optimizes space utilization.
- 0.8 mm ultra-thin profile: Ideal for low-profile designs. -
Q:Why choose DFN-24 over alternatives?
A:Critical advantages:
- Miniaturization: 40% smaller than equivalent SOIC packages.
- Thermal Performance: Direct PCB heat path reduces junction temp by 15°C.
- Electrical Benefits: Low-inductance design (<0.5 nH) for high-frequency apps.
- Reliability: Moisture-resistant substrate (MSL 3 certified). -
Q:What are common technical specs?
A:Standard configurations (consult datasheets):
- Body Size: 6.35 × 5.08 mm.
- Height: 0.8 mm.
- Pin Pitch: 0.5 mm.
- Material: Copper-alloy leads with Ni/Pd/Au plating.
- Temp Range: -40°C to +125°C. -
Q:Where is DFN-24 typically applied?
A:Dominant use cases:
- Power Converters: Buck/boost ICs (e.g., TPS62130).
- RF Modules: Bluetooth/Wi-Fi transceivers (e.g., CC2640).
- Sensor Interfaces: MEMS accelerometers (e.g., LIS2DH12). -
Q:What are critical assembly guidelines?
A:Key recommendations:
- PCB Design: 4×4 thermal vias array under pad (0.3 mm diameter).
- Solder Paste: Type 4 solder recommended for fine-pitch.
- Reflow Profile: Peak temp ≤ 245°C (Pb-free process).
- Inspection: X-ray (AXI) mandatory for pad void detection.