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DIP-2
DIP-2
The DIP-2 (Dual In-line Package with 2 pins) is a through-hole package designed for low-pin-count applications. Featuring through-hole design, robust mechanical structure, and easy manual soldering, it delivers compact size and superior thermal dissipation. Typical dimensions are 7.62mm × 5.08mm × 3.3mm with a 2.54mm pin pitch, making it ideal for relays, sensors, and simple control circuits. Its through-hole pins enable direct PCB thermal transfer, while RoHS-compliant materials ensure reliability in industrial environments.
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Интегральные схемы (ИС)
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1 + 10 + 25 + 50 + >=100 -
MOQ : 1 Наличность : 7520
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Photoconductive cell; 8 kilohms (typ.); 200 kilohms (min.); 0.75 (typ.); to-8
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1 + 10 + 25 + 50 + >=100 -
Наличность : 1
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Light dependent resistor
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1 + 10 + 25 + 50 + >=100 -
MOQ : 1 Наличность : 5757
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Photoconductive Cells and Analog Optoisolators (Vactrols)
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1 + 10 + 25 + 50 + >=100 -
MOQ : 1 Наличность : 1400
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Photoconductive Cells and Analog Optoisolators (Vactrols)
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1 + 10 + 25 + 50 + >=100 -
MOQ : 1 Наличность : 30
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PACKAGE DIMENSIONS inch (mm)
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1 + 10 + 25 + 50 + >=100 -
MOQ : 1 Наличность : 646
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Hermetic photocell
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1 + 10 + 25 + 50 + >=100 -
Наличность : 1
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Интегральные схемы (ИС)
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1 + 10 + 25 + 50 + >=100 -
MOQ : 1 Наличность : 15
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Photoconductive cell, cds
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1 + 10 + 25 + 50 + >=100 -
Наличность : 1
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Интегральные схемы (ИС)
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1 + 10 + 25 + 50 + >=100 -
MOQ : 1 Наличность : 3300
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PACKAGE DIMENSIONS inch (mm)
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1 + 10 + 25 + 50 + >=100 -
MOQ : 1 Наличность : 5544
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Photocell
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1 + 10 + 25 + 50 + >=100 -
MOQ : 1 Наличность : 656
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Hermetic photocell
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1 + 10 + 25 + 50 + >=100 -
MOQ : 1 Наличность : 3300
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Photoconductive cell; 20 kilohms (typ.); 500 kilohms; 0.80 (typ.); -40 degc
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1 + 10 + 25 + 50 + >=100 -
MOQ : 1 Наличность : 10000
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Photocell
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1 + 10 + 25 + 50 + >=100 -
MOQ : 1 Наличность : 10
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Photocell
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1 + 10 + 25 + 50 + >=100 -
MOQ : 1 Наличность : 4565
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Photocell
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1 + 10 + 25 + 50 + >=100 -
MOQ : 1 Наличность : 4565
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Hermetic photocell
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1 + 10 + 25 + 50 + >=100 -
MOQ : 1 Наличность : 4565
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Photocell, hermetically packaged
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1 + 10 + 25 + 50 + >=100 -
MOQ : 1 Наличность : 85
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Интегральные схемы (ИС)
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1 + 10 + 25 + 50 + >=100 -
MOQ : 1 Наличность : 90000
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Интегральные схемы (ИС)
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1 + 10 + 25 + 50 + >=100 -
MOQ : 1 Наличность : 14000
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Интегральные схемы (ИС)
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1 + 10 + 25 + 50 + >=100 -
MOQ : 1 Наличность : 9700
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Интегральные схемы (ИС)
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1 + 10 + 25 + 50 + >=100 -
MOQ : 1 Наличность : 16800
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1 + 10 + 25 + 50 + >=100 -
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Q:What defines the physical structure of DIP-2?
A:Key features include:
- Dual in-line pins: Through-hole mounting with 2 axial leads.
- Standardized spacing: 2.54 mm (0.1") pin pitch for breadboard/prototyping compatibility.
- Robust housing: Molded plastic body (typically ~10 mm width).
- Lead length: Extended leads (~3–5 mm) for manual soldering ease. -
Q:Why choose DIP-2 over alternatives?
A:Critical advantages:
- Hands-on prototyping: Ideal for breadboards and manual assembly.
- Cost-effective: Low tooling/setup costs for low-volume production.
- Repairability: Easy desoldering/replacement vs. SMD packages.
- Legacy compatibility: Widely used in educational/DIY electronics. -
Q:What are common technical specs?
A:Standard configurations (consult datasheets):
- Body Size: ~6.5×10 mm (varies by manufacturer).
- Height: ~3–5 mm (excluding leads).
- Pin Pitch: 2.54 mm (fixed).
- Material: Plastic body with tin/lead-plated steel leads.
- Temp Range: -40°C to +85°C (standard grade). -
Q:Where is DIP-2 typically applied?
A:Dominant use cases:
- Discrete components: Diodes, transistors (e.g., 1N4148, 2N3904).
- Educational kits: Arduino/Raspberry Pi peripheral modules.
- Legacy systems: Repair/replacement in vintage electronics. -
Q:What are critical assembly guidelines?
A:Key recommendations:
- PCB Design: 0.9–1.2 mm hole diameter for lead insertion.
- Soldering: Hand-solder at 300–350°C (3 sec max per pin).
- Inspection: Visual check for lead alignment and solder fillets.
- Handling: Avoid excessive lead bending to prevent breakage.