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FBGA-780

The FBGA-780 (Fine-Pitch Ball Grid Array-780) is a surface-mount package designed for high-density integrated circuits. Featuring a leadless design, 780 high-density solder balls, and an exposed thermal pad, it delivers significant miniaturization, superior heat dissipation, and reduced signal path inductance. Typical dimensions are 29×29 mm with a 0.8 mm ball pitch and a profile height under 2 mm, making it ideal for high-performance computing, networking/telecom ASICs, and graphics processing units (GPUs). Its bottom-terminal contacts enable direct PCB thermal transfer, while RoHS-compliant materials ensure reliability in industrial environments.
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