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HTSOP-8

The HTSOP-8 (Heat-Thin Small Outline Package - 8 leads) is a surface-mount package designed for high-density circuits. Featuring an **exposed thermal pad**, **leadless design**, and **low profile**, it delivers **superior heat dissipation** and **space-saving integration**. Typical dimensions are **5.0×6.4 mm** with a **0.65 mm** pin pitch and a height typically of **1.2 mm**, making it ideal for **power management ICs**, **DC-DC converters**, and **voltage regulators**. Its **bottom-terminal contacts** enable direct PCB thermal transfer, while **RoHS-compliant materials** ensure reliability in industrial environments.
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