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QFP144

The QFP144 (Quad Flat Package 144) is a surface-mount package designed for high-density integrated circuits. Featuring 144 leads, an exposed thermal pad, and a low profile, it delivers significant space savings, superior heat dissipation, and reliable electrical connections. Typical dimensions are 20×20 mm with a 0.5 mm pin pitch and a typical height of 1.4 mm, making it ideal for microcontrollers, ASICs, and FPGAs in industrial automation, automotive electronics, and communication systems. Its bottom-exposed thermal pad enables direct PCB thermal transfer, while RoHS-compliant materials ensure reliability in demanding industrial environments.
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