TO 247
- Картинка & Модели
- Описание
- Соедините цену
- Количество
- Операция
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VISHAY VS-60CPH03-N3 Fast / Ultrafast Diode, 300V, 60A, Dual Common Cathode, 1.25V, 39ns, 300A New
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1 + 10 + 25 + 50 + >=100 -
Наличность : 1
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Standard Recovery Diode, 400 V, 60 A, Single, 1.25 V, 85 ns, 600 A
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1 + 10 + 25 + 50 + >=100 -
MOQ : 1 Наличность : 11
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THERMISTOR, NTC; Series:B578; Thermistor type:NTC; Resistance:100kR; Tolerance, resistance:+/-1%; Beta value:4540; Temperature, lower limit, beta value:25(degree C); Temperature, upper limit, beta value:100(degree C); Temp, op. RoHS Compliant: Yes
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1 + 10 + 25 + 50 + >=100 -
MOQ : 1 Наличность : 29688
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Trans IGBT Chip N-CH 1200V 50A 192000mW 3-Pin(3+Tab) TO-247 Tube
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1 + 10 + 25 + 50 + >=100 -
MOQ : 1 Наличность : 240
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Q:What defines the physical structure of TO-247?
A:Key features include:
- Leaded design: Robust through-hole or surface-mountable leads.
- Central thermal pad: Large exposed metal base (typically ~15×20 mm coverage).
- 3-pin layout: Standard configuration with linear lead arrangement.
- High-profile body: ~10 mm height for enhanced heat dissipation. -
Q:Why choose TO-247 over alternatives?
A:Critical advantages:
- Power handling: Supports high-current applications (up to 75A).
- Thermal Performance: Integrated metal tab for direct heatsink mounting.
- Electrical Benefits: Low-resistance leads for reduced conduction losses.
- Reliability: Industrial-grade epoxy housing (UL94 V-0 rated). -
Q:What are common technical specs?
A:Standard configurations (consult datasheets):
- Body Size: 16×21 mm (varies by variant).
- Height: 10 mm (excluding leads).
- Pin Pitch: 5.45 mm (standard spacing).
- Material: Copper-alloy leads with Ni/Pd plating.
- Temp Range: -55°C to +150°C (operational). -
Q:Where is TO-247 typically applied?
A:Dominant use cases:
- Power electronics: Inverters (e.g., IGBT modules like STGW30H60DF).
- Motor drives: High-current switching (e.g., MOSFETs in industrial drives).
- Renewable energy: Solar MPPT controllers and wind turbine systems. -
Q:What are critical assembly guidelines?
A:Key recommendations:
- PCB Design: Heavy copper traces (≥2 oz) for thermal management.
- Mounting: Secure heatsink with thermal grease (0.5–1 Nm torque).
- Wave Soldering: Preheat ≤120°C, peak solder temp ≤260°C.
- Inspection: Visual check for lead coplanarity (±0.1 mm tolerance).



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