TO-252

Q:What defines the physical structure of TO-252 (DPAK)?

A:Key features include:
- Leadless bottom-mounted pads: Solderable tabs for PCB attachment.
- Central thermal pad: Large exposed pad (~60% coverage) for heat dissipation.
- 3-pin layout: Single-row configuration with gull-wing leads.
- Low profile: Typical height of 2.3 mm for space-constrained designs.

Q:Why choose TO-252 over alternatives?

A:Critical advantages:
- Miniaturization: 30% smaller footprint than TO-220.
- Thermal Performance: Direct PCB heat path via central pad (RθJA as low as 50°C/W).
- Electrical Benefits: Low-inductance leads for power switching applications.
- Reliability: Molded epoxy body with moisture resistance (MSL 3).

Q:What are common technical specs?

A:Standard configurations (consult datasheets):
- Body Size: 6.5 × 6.2 mm.
- Height: 2.3 mm.
- Pin Pitch: 2.3 mm (lead-to-lead).
- Material: Copper-alloy leads with Sn-plating.
- Temp Range: -40°C to +150°C.

Q:Where is TO-252 typically applied?

A:Dominant use cases:
- Power Converters: Buck/boost ICs (e.g., LM2675).
- Motor Drivers: H-bridge modules (e.g., DRV8873).
- Voltage Regulators: LDOs (e.g., LM1117).

Q:What are critical assembly guidelines?

A:Key recommendations:
- PCB Design: Minimum 4 thermal vias under central pad (0.3 mm diameter).
- Solder Paste: Type 3 or 4 recommended for pad coverage.
- Reflow Profile: Peak temp ≤ 250°C (Pb-free process).
- Inspection: X-ray (AXI) to verify voiding <15% on thermal pad.