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TO-252-3

The TO-252-3 is a surface-mount package designed for high-power applications. Featuring exposed thermal pad, three-terminal design, and compact form factor, it delivers superior heat dissipation and space efficiency. Typical dimensions are 6.6×6.2 mm with a 2.54 mm pin pitch, making it ideal for power management ICs in portable devices, automotive electronics, and industrial systems. Its exposed thermal pad enables direct PCB thermal transfer, while RoHS-compliant materials ensures reliability in industrial environments.
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