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TSOP-54

The TSOP-54 (Thin Small Outline Package) is a surface-mount package designed for high-density integrated circuits. Featuring an ultra-thin profile, high pin density, and gull-wing leads, it delivers compact size and reduced signal interference. Typical dimensions are 22.22 mm × 10.16 mm × 1.2 mm with a 0.8 mm pin pitch, making it ideal for memory devices in portable electronics. Its gull-wing lead design enables direct PCB thermal transfer, while RoHS-compliant materials ensure reliability in industrial environments.
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