ВСЕ КАТЕГОРИИTSSOP 20
- Картинка & Модели
- Описание
- Соедините цену
- Количество
- Операция
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IC ENCODER LINEAR 20-TSSOP
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1 + 10 + 25 + 50 + >=100 -
MOQ : 1 Наличность : 222
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Интегральные схемы (ИС)
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1 + 10 + 25 + 50 + >=100 -
MOQ : 1 Наличность : 414
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Интегральные схемы (ИС)
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1 + 10 + 25 + 50 + >=100 -
MOQ : 1 Наличность : 1600
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Single phase energy metering IC with pulsed output and digital calibratio...
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1 + 10 + 25 + 50 + >=100 -
1
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Single phase energy metering IC with pulsed output and digital calibration
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1 + 10 + 25 + 50 + >=100 -
MOQ : 1 Наличность : 10000
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Single phase energy metering IC with pulsed output and digital calibratio...
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1 + 10 + 25 + 50 + >=100 -
MOQ : 1 Наличность : 10000
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Low-Voltage CMOS Octal Transparent Latch Flow Through Pinout
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1 + 10 + 25 + 50 + >=100 -
MOQ : 1 Наличность : 26800
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IDT
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1 + 10 + 25 + 50 + >=100 -
MOQ : 1 Наличность : 1456
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Hex Inverters
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1 + 10 + 25 + 50 + >=100 -
MOQ : 1 Наличность : 1023
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Ultra Low Dropout Linear Regulators(4A) for Desktop PC
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1 + 10 + 25 + 50 + >=100 -
MOQ : 1 Наличность : 309
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Q:What defines the physical structure of TSSOP-20?
A:Key features include:
- Gull-wing leads: Surface-mountable with outward-bent pins for reliable soldering.
- Compact footprint: 20-pin layout with dual-row (2×10) symmetrical arrangement.
- Thin profile: Typical body height of 1.0 mm for space-constrained designs.
- Standardized dimensions: Compatible with automated pick-and-place systems. -
Q:Why choose TSSOP-20 over alternatives?
A:Critical advantages:
- Miniaturization: 30% smaller than equivalent SOIC packages.
- Thermal Performance: Exposed die pad (optional) for improved heat dissipation.
- Electrical Benefits: Short lead lengths reduce inductance and signal noise.
- Reliability: Moisture-resistant (MSL3-rated) mold compound for harsh environments. -
Q:What are common technical specs?
A:Standard configurations (consult datasheets):
- Body Size: 6.5 × 4.4 mm (nominal).
- Height: 1.0 mm (max).
- Pin Pitch: 0.65 mm (fine-pitch compatible).
- Material: Copper-alloy leads with matte-tin plating.
- Temp Range: -40°C to +125°C (industrial grade). -
Q:Where is TSSOP-20 typically applied?
A:Dominant use cases:
- Mixed-signal ICs: Data converters (e.g., TI ADS8320).
- Power Management: Voltage regulators (e.g., LT1963).
- Communication: Serial interfaces (e.g., MAX3232 transceivers). -
Q:What are critical assembly guidelines?
A:Key recommendations:
- PCB Design: Use thermal relief patterns for leads; include ground vias under exposed pad (if present).
- Solder Paste: Type 3 or 4 recommended for fine-pitch soldering.
- Reflow Profile: Peak temperature ≤ 250°C (Pb-free) with 60–90 sec above 217°C.
- Inspection: Optical or X-ray (AXI) required to verify fine-pitch solder joints.