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WSON-6
WSON-6
The WSON-6 (Wafer-Level Small Outline No-lead 6) is a surface-mount package designed for high-density circuits. Featuring a leadless design, an exposed thermal pad, and an ultra-thin profile, it delivers superior heat dissipation and reduced signal interference. Typical dimensions are 3×3 mm with a 0.5 mm pin pitch and a 0.8 mm height, making it ideal for power management ICs in portable devices, IoT devices, and compact sensor modules. Its bottom-terminal contacts enable direct PCB thermal transfer, while RoHS-compliant materials ensure reliability in industrial environments.
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Интегральные схемы (ИС)
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6-A Single-Channel Synchronous-Rectifier Driver
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ultra-low-IQ, low-dropout linear voltage regulator
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ultra-low-IQ, low-dropout linear voltage regulator
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Tiny 7A MOSFET Gate Driver 6-WSON -40℃ to 125℃
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IC BOOST CONV SYNC 6WSON
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Processor Supervisor 3.084V 1 Active Low/Open Drain Automotive 6-Pin WSON T/R
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Temperature Sensor IC, Digital, ± 0.3°C, -40 °C, 125 °C, WSON, 6 Pins
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Board Mount Humidity Sensors Low Power, 3% Accuracy Digital Humidity Sensor with Integrated Temperature Sensor 6-WSON -40 to 125
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33V Flat-Clamp Surge Protection Device
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Diode TVS Single Uni-Dir 5V 400W 6-Pin WSON EP T/R
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Single Channel High-Speed, Low-Side Gate Driver (With 4-A/8-A Peak Source/Sink).
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500nA, IQ 150mA, Ultra-Low Quiescent Current Low-Dropout Linear Regulator
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500nA, IQ 150mA, Ultra-Low Quiescent Current Low-Dropout Linear Regulator
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1% High-Accuracy, 1-A, Low-Dropout Regulator with Reverse Current Protection
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Low Noise, High PSRR 1A Active Filter
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200-mA, Low Quiescent Current, UltraLow Noise, High PSRR, Low Dropout
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Low-Side Power MOSFET Driver With Body Diode Conduction Sensing
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Conv DC-DC 0.9V to 5V Non-Inv/Inv/Step Up/Step Down Single-Out 2.5V/3V/3.3V 0.25A 6-Pin WSON EP T/R
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Conv DC-DC 2.3V to 5.5V Synchronous Step Up Single-Out 5V 0.5A Automotive 6-Pin WSON EP T/R
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250-mA, Ultralow IQ, Fast Transient Response, RF Low-Dropout Linear Regulator
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350mA, Ultra-Low VIN, RF Low-Dropout Linear Regulator with Bias Pin for Automotive
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350mA, Ultra-Low VIN, RF Low-Dropout Linear Regulator with Bias Pin for Automotive
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1
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350mA, Ultra-Low VIN, RF Low-Dropout Linear Regulator with Bias Pin for Automotive
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1 + 10 + 25 + 50 + >=100 -
1
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350mA, Ultra-Low VIN, RF Low-Dropout Linear Regulator with Bias Pin for Automotive
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1 + 10 + 25 + 50 + >=100 -
1
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350mA, Ultra-Low VIN, RF Low-Dropout Linear Regulator with Bias Pin for Automotive
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1 + 10 + 25 + 50 + >=100 -
1
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350mA, Ultra-Low VIN, RF Low-Dropout Linear Regulator with Bias Pin for Automotive
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1 + 10 + 25 + 50 + >=100 -
1
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350mA, Ultra-Low VIN, RF Low-Dropout Linear Regulator with Bias Pin for Automotive
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1 + 10 + 25 + 50 + >=100 -
1
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350mA, Ultra-Low VIN, RF Low-Dropout Linear Regulator with Bias Pin for Automotive
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1 + 10 + 25 + 50 + >=100 -
1
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350mA, Ultra-Low VIN, RF Low-Dropout Linear Regulator with Bias Pin for Automotive
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1 + 10 + 25 + 50 + >=100 -
1
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Automotive Low-Quiescent-Current 1% Accurate Supervisor With Programmable Delay
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1
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Low-Quiescent-Current 1% Accurate Supervisor With Programmable Delay
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1 + 10 + 25 + 50 + >=100 -
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Automotive Low-Quiescent-Current 1% Accurate Supervisor With Programmable Delay
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1 + 10 + 25 + 50 + >=100 -
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Low-Quiescent-Current 1% Accurate Supervisor With Programmable Delay
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1 + 10 + 25 + 50 + >=100 -
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Automotive Low-Quiescent-Current 1% Accurate Supervisor With Programmable Delay
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1 + 10 + 25 + 50 + >=100 -
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Low-Quiescent-Current 1% Accurate Supervisor With Programmable Delay
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1 + 10 + 25 + 50 + >=100 -
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Low-Quiescent-Current 1% Accurate Supervisor With Programmable Delay
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1 + 10 + 25 + 50 + >=100 -
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Automotive Low-Quiescent-Current 1% Accurate Supervisor With Programmable Delay
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1 + 10 + 25 + 50 + >=100 -
1
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350mA, Ultra-Low VIN, RF Low-Dropout Linear Regulator with Bias Pin for Automotive
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1 + 10 + 25 + 50 + >=100 -
1
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350mA, Ultra-Low VIN, RF Low-Dropout Linear Regulator with Bias Pin for Automotive
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1 + 10 + 25 + 50 + >=100 -
1
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350mA, Ultra-Low VIN, RF Low-Dropout Linear Regulator with Bias Pin for Automotive
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1 + 10 + 25 + 50 + >=100 -
1
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350mA, Ultra-Low VIN, RF Low-Dropout Linear Regulator with Bias Pin
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1 + 10 + 25 + 50 + >=100 -
1
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350mA, Ultra-Low VIN, RF Low-Dropout Linear Regulator with Bias Pin
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1 + 10 + 25 + 50 + >=100 -
1
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350mA, Ultra-Low VIN, RF Low-Dropout Linear Regulator with Bias Pin for Automotive
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1 + 10 + 25 + 50 + >=100 -
1
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350mA, Ultra-Low VIN, RF Low-Dropout Linear Regulator with Bias Pin for Automotive
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1 + 10 + 25 + 50 + >=100 -
1
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350mA, Ultra-Low VIN, RF Low-Dropout Linear Regulator with Bias Pin for Automotive
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1 + 10 + 25 + 50 + >=100 -
1
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Low Noise, High-Bandwidth PSRR Low-Dropout 150mA Linear Regulator for Automotive Applications
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1 + 10 + 25 + 50 + >=100 -
1
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Low Noise, High-Bandwidth PSRR Low-Dropout 150mA Linear Regulator for Automotive Applications
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1 + 10 + 25 + 50 + >=100 -
1
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Low Noise, High-Bandwidth PSRR Low-Dropout 150mA Linear Regulator for Automotive Applications
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1 + 10 + 25 + 50 + >=100 -
1
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Low Noise, High-Bandwidth PSRR Low-Dropout 150mA Linear Regulator for Automotive Applications
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1 + 10 + 25 + 50 + >=100 -
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Q:What defines the physical structure of WSON-6?
A:Key features include:
- Leadless bottom-mounted pads: Ensures direct PCB connectivity.
- Central thermal pad: ~60% coverage for efficient heat dissipation.
- 6-pin layout: Dual-row symmetrical arrangement.
- Ultra-thin profile: 0.5 mm height for space-constrained designs. -
Q:Why choose WSON-6 over alternatives?
A:Critical advantages:
- Miniaturization: 40% smaller than SOIC-8.
- Thermal Performance: Direct PCB heat path reduces junction temperature by ~15%.
- Electrical Benefits: Low-inductance design (<1 nH) for high-frequency stability.
- Reliability: Moisture-resistant substrate (MSL3 rating). -
Q:What are common technical specs?
A:Standard configurations (consult datasheets):
- Body Size: 2.0 × 2.0 mm.
- Height: 0.5 mm.
- Pin Pitch: 0.65 mm.
- Material: Copper-alloy leads with matte Sn plating.
- Temp Range: -40°C to +125°C. -
Q:Where is WSON-6 typically applied?
A:Dominant use cases:
- Power Management: DC-DC converters (e.g., TPS62090).
- RF Modules: Bluetooth/Wi-Fi transceivers (e.g., CC2541).
- Sensor Interfaces: MEMS sensors (e.g., BME280). -
Q:What are critical assembly guidelines?
A:Key recommendations:
- PCB Design: 4×4 thermal vias under central pad (0.3 mm diameter).
- Solder Paste: Type 4 (5–15 µm particle size) recommended.
- Reflow Profile: Peak temp ≤ 250°C (Pb-free process).
- Inspection: X-ray (AXI) mandatory for pad void detection.