ZIP-27
- Картинка & Модели
- Описание
- Соедините цену
- Количество
- Операция
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PIONEER SPEAKER OUTPUT IC For DEH-1650 ABD AUDIO & POWER( = PA2032A )
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1 + 10 + 25 + 50 + >=100 -
MOQ : 1 Наличность : 1998
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Audio Amplifiers I2C BUS CONTROLLED 4X45 W PWR AMPLIFIER
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1 + 10 + 25 + 50 + >=100 -
MOQ : 1 Наличность : 200
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Audio Power Amplifier, 48 W, AB, 4 Channel, 8V to 18V, Flexiwatt, 27 Pins
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1 + 10 + 25 + 50 + >=100 -
MOQ : 1 Наличность : 88
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Audio Amplifiers 4 x 50 W MOSFET Quad Bridge Pwr Amplifier
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1 + 10 + 25 + 50 + >=100 -
MOQ : 1 Наличность : 2021
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2 x 75W multifunction dual-bridge power amplifier with integrated digital diagnostics,Special Purpose Audio Amplifiers 2 x 75W Multifunct Dual-Bridge Pwr Amp
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1 + 10 + 25 + 50 + >=100 -
MOQ : 1 Наличность : 394
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QUAD POWER AMPLIFIER WITH BUILT-IN VOLTAGE CONVERTER
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1 + 10 + 25 + 50 + >=100 -
MOQ : 1 Наличность : 267
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Audio Power Amplifier, 75 W, AB, 4 Channel, 8V to 18V, Flexiwatt, 27 Pins
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1 + 10 + 25 + 50 + >=100 -
MOQ : 1 Наличность : 5000
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4 x 50W multifunction quad power amplifier with built-in diagnostics feature,Special Purpose Audio Amplifiers 4 x 50W Multi Quad Power Amplifer D
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1 + 10 + 25 + 50 + >=100 -
MOQ : 1 Наличность : 90
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Audio Amp Speaker 4-CH Stereo 68W Class-AB Automotive 27-Pin(27+Tab) FLEXIWATT(Horizontal) Tube
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1 + 10 + 25 + 50 + >=100 -
MOQ : 1 Наличность : 135
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Audio Amp Speaker 4-CH Stereo 60W Class-AB Automotive 27-Pin FLEXIWATT(Vertical) Tube
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1 + 10 + 25 + 50 + >=100 -
MOQ : 1 Наличность : 5759
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5-phase Stepper Motor Star Connection Unipolar Driver IC
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1 + 10 + 25 + 50 + >=100 -
MOQ : 1 Наличность : 150
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Q:What defines the physical structure of ZIP-27?
A:Key features include:
- Leadless bottom-mounted pads: Ensures stable PCB attachment.
- Central thermal pad (80% coverage): Optimizes heat dissipation.
- 27-pin layout with dual-row staggered arrangement: Balances pin density and routing flexibility.
- 1.2 mm ultra-thin profile: Ideal for space-constrained designs. -
Q:Why choose ZIP-27 over alternatives?
A:Critical advantages:
- Miniaturization: 30% smaller than SOP-28 packages.
- Thermal Performance: Direct PCB heat path reduces junction temperature by 15°C.
- Electrical Benefits: Low-inductance design (<1 nH) for high-frequency signals.
- Reliability: Moisture-resistant substrate (MSL3 rated). -
Q:What are common technical specs?
A:Standard configurations (consult datasheets):
- Body Size: 7.0 × 5.0 mm
- Height: 1.2 mm
- Pin Pitch: 0.5 mm
- Material: Copper-alloy leads with Ni/Pd/Au plating
- Temp Range: -40°C to +125°C -
Q:Where is ZIP-27 typically applied?
A:Dominant use cases:
- Power Converters: e.g., Buck/boost ICs (e.g., TPS54302).
- RF Modules: e.g., 2.4 GHz transceivers (e.g., CC2541).
- Sensor Interfaces: e.g., MEMS accelerometers (e.g., ADXL345). -
Q:What are critical assembly guidelines?
A:Key recommendations:
- PCB Design: 4+ thermal vias under central pad (0.3 mm diameter).
- Solder Paste: Type 4 solder recommended for fine-pitch printing.
- Reflow Profile: Peak temp ≤ 245°C (Pb-free process).
- Inspection: X-ray (AXI) mandatory for void detection (<15% acceptable).



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