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ZIP-27

The ZIP-27 (ZIP-27) is a surface-mount package designed for high-density circuits. Featuring leadless design, exposed thermal pad, and ultra-thin profile, it delivers superior heat dissipation and reduced signal interference. Typical dimensions are 6.5×10×2.0 mm with a 1.27 mm pin pitch, making it ideal for power management ICs in portable devices, automotive electronics, and industrial control systems. Its bottom-terminal contacts enable direct PCB thermal transfer, while RoHS-compliant materials ensure reliability in industrial environments.
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