ZILOG parts naming conventions

ZILOG parts naming conventions 

1. Prefix

2. Device model

3. Speed: blank 2.5MHz, A 4.0MHz, B 6.0MHz

H 8.0MHz, L Low power consumption, directly marked with numbers

4. Package form:

A Very small four-sided lead flat package C Ceramic brazing

D Ceramic double in-line E ceramic with window

F Plastic four-sided lead flat package G Ceramic pin array

H Miniature package I PCB chip carrier

K ceramic dual in-line, with window L ceramic leadless chip carrier

P plastic double row inline Q ceramic four row

S miniature package V plastic leaded chip carrier

5. Temperature range

E -40 ℃ to 100 ℃, M -55 ℃ to 125 ℃, S 0 ℃ to 70 ℃

6. Environmental testing process:

A Stress Seal, B Military Grade, C Plastic Standard, D Stress Plastic, E Seal Standard

Zilog is the most trusted provider of application-specific embedded system single-chip (SoC) solutions for the industrial and consumer markets. Zilog? Originated from an award-winning architecture in the microprocessor and microcontroller industries, it has been upgraded from core silicon technology to include SoCs, single board computers, application software stacks and development tools. With it, embedded designers in areas such as energy management, monitoring and metering, and motion detection can accelerate time-to-market.

Тег: ZILOG

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